Company Filing History:
Years Active: 2008
Title: Masaru Kawakami: Innovator in Semiconductor Technology
Masaru Kawakami is a prominent inventor based in Machida, Japan. He has made significant contributions to the field of semiconductor technology, particularly in high-density packaging solutions. His innovative approach has led to advancements that enhance the efficiency and functionality of semiconductor devices.
Latest Patents
Masaru Kawakami holds a patent for a semiconductor device designed for high-density packaging. This device features a multi-layer substrate with a first-stage chip connected electrically to it. The design includes multiple package substrates stacked in three stages on the multi-layer substrate, each connected to an underlying wiring substrate through solder balls. The device incorporates second-, third-, and fourth-stage chips that are electrically connected to the respective package substrates. Notably, the bottom multi-layer substrate, which houses a logic chip, has a greater number of wiring layers compared to the package substrates containing memory chips. This innovative design allows for efficient use of wiring layers, enabling the mounting of additional semiconductor elements or passive components, thereby achieving high-density packaging in a stacked type package.
Career Highlights
Masaru Kawakami is associated with Renesas Technology Corporation, where he has been instrumental in developing cutting-edge semiconductor solutions. His work has not only advanced the technology but has also contributed to the company's reputation as a leader in the semiconductor industry.
Collaborations
Throughout his career, Masaru Kawakami has collaborated with notable colleagues, including Takashi Kikuchi and Ryosuke Kimoto. These collaborations have fostered an environment of innovation and have led to the successful development of various semiconductor technologies.
Conclusion
Masaru Kawakami's contributions to semiconductor technology exemplify the spirit of innovation. His patent for a high-density packaging semiconductor device showcases his expertise and commitment to advancing the field. His work continues to influence the industry and inspire future innovations.