Masao Sekibata

Title: The Innovative Contributions of Masao Sekibata

Introduction

Masao Sekibata is a notable inventor based in Kunitachi, Japan. He has made significant contributions to the field of plating methods, particularly in the context of electronic components. With a total of 6 patents to his name, Sekibata's work has had a profound impact on the industry.

Latest Patents

Sekibata's latest patents include a multilayer plating method and a plating process for electronic parts. The multilayer plating method involves forming a primary plated film on the surface of underlayer metal, followed by a heating process that creates diffusion layers. A mechanical abrasion exposes these diffusion layers, allowing for the formation of a secondary plated film. This innovative method ensures a uniform multilayer plated film with excellent adhesive properties, even when dissimilar metals are used.

His plating process for electronic parts addresses a common issue where hydrogen gas produced during Ni and Co-plating can create voids in the Au-Si alloy during subsequent heating. Sekibata's invention includes an annealing step after Au-plating to eliminate these residual gases, thereby preventing defects in electronic components.

Career Highlights

Throughout his career, Sekibata has worked with prominent companies such as Hitachi, Ltd. and the VLSI Technology Research Association. His experience in these organizations has allowed him to refine his expertise in plating technologies and contribute to advancements in the field.

Collaborations

Sekibata has collaborated with notable colleagues, including Kanji Otsuka and Kazumichi Mitsusada. Their joint efforts have further propelled innovations in plating methods and electronic component manufacturing.

Conclusion

Masao Sekibata's contributions to the field of plating methods have established him as a key figure in the industry. His innovative patents and collaborations reflect his commitment to advancing technology in electronic components.