The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 1990
Filed:
Sep. 22, 1988
Applicant:
Inventors:
Tetsuya Watanabe, Hadano, JP;
Masao Sekibata, Kunitachi, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B05D / ;
U.S. Cl.
CPC ...
428610 ; 428665 ; 428680 ; 427123 ; 427290 ;
Abstract
A primary plated film is formed on the surface of underlayer metal. Next, the heating process is performed and diffusion layers of the underlayer metal and primary plated film are formed. A mechanical abrasion is performed to the surface of the primary plated film, thereby exposing the diffusion layers. Thereafter, a secondary plated film is formed on the exposed diffusion layers. With this multilayer plating method, even in the case of the dissimilar metals, a uniform multilayer plated film of a good adhesive property is derived.