This inventor holds 4 USPTO granted patents. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 1993-2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1993-2004
Title: Masao Kawasumi: Innovator in Semiconductor Technology
Introduction
Masao Kawasumi is a prominent inventor based in Hitachi, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on enhancing the performance and reliability of semiconductor devices.
Latest Patents
Kawasumi's latest patents include a resin-sealed semiconductor device and an adhesive composition suitable for bonding semiconductor chips. The resin-sealed semiconductor device features a lead frame with a die bond pad and an inner lead, designed to improve the durability and efficiency of semiconductor chips. The adhesive composition comprises an epoxy resin that minimizes warpage during the bonding process, ensuring optimal performance.
Career Highlights
Masao Kawasumi is associated with Hitachi Chemical Company, Ltd., where he has been instrumental in advancing semiconductor materials and technologies. His innovative approaches have led to the development of materials that meet stringent performance criteria in the semiconductor industry.
Collaborations
Kawasumi has collaborated with notable colleagues, including Nobuo Ichimura and Mitsuo Yamazaki. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Masao Kawasumi's contributions to semiconductor technology exemplify the impact of innovation in enhancing electronic devices. His patents reflect a commitment to advancing the field and improving the functionality of semiconductor materials.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile