The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1993
Filed:
Apr. 17, 1991
Applicant:
Inventors:
Mitsuo Yamazaki, Hitachi, JP;
Nobuo Ichimura, Takahagi, JP;
Yasuo Miyamoto, Hitachi, JP;
Koei Fujita, Hitachi, JP;
Masao Kawasumi, Hitachi, JP;
Assignee:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B / ;
U.S. Cl.
CPC ...
252512 ; 252513 ; 252514 ; 156330 ; 523427 ; 523457 ; 524 94 ; 524183 ;
Abstract
An electroconductive resin paste suitable for bonding a semiconductor element onto a substrate and exhibiting a superior adhesion strength and processability when heated to 200.degree. C. to 350.degree. C., and a process for producing a semiconductor device using the electroconductive resin paste are provided, which electroconductive resin paste comprises.