Masao Kainuma

Title: Masao Kainuma: Innovator in Semiconductor Packaging

Introduction

Masao Kainuma is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His innovative designs have advanced the technology used in electronic components.

Latest Patents

Kainuma's latest patents include a stem for a semiconductor package that features an eyelet and lead. This design incorporates an eyelet with a through hole, a lead extending through the hole, and a sealing part that secures the lead. The eyelet is made of a material that consists of 45% Ni—Fe, which has a thermal expansion coefficient greater than that of the sealing part. Another patent describes a stem that includes a base member with a raised portion and a through-hole. The lead is inserted into the through-hole and fixed with a material, allowing for electrical connection to a substrate.

Career Highlights

Throughout his career, Kainuma has worked with prominent companies in the semiconductor industry. He has been associated with Shinko Electric Industries Co., Ltd. and Korea Shinko Microelectronics Co., Ltd. His work in these organizations has contributed to the development of advanced semiconductor technologies.

Collaborations

Kainuma has collaborated with talented individuals such as Takumi Ikeda and Yasuyuki Kimura. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Masao Kainuma's contributions to semiconductor packaging demonstrate his expertise and commitment to innovation. His patents reflect a deep understanding of materials and design, making him a valuable figure in the field.