The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Dec. 20, 2021
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventor:
Masao Kainuma, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/0231 (2021.01); F21V 31/00 (2006.01); H01L 23/13 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0231 (2021.01); F21V 31/005 (2013.01); H01L 23/13 (2013.01); H01L 23/142 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01);
Abstract
A stem for a semiconductor package includes an eyelet having a through hole formed therethrough, a lead extending through the through hole, and a sealing part configured to seal the through hole around the lead, wherein a main material of the eyelet is 45% Ni—Fe, and wherein a thermal expansion coefficient of the eyelet is greater than a thermal expansion coefficient of the sealing part.