Shinko Electric Industries Co., Ltd.

Korea Shinko Microelectronics Co., Ltd.

Masao Kainuma

Yasuyuki Kimura

Takumi Ikeda

Tae Uk Gang

Hyung Gon Kim

Chang Hun Gang

A stem for a semiconductor package includes an eyelet having a through hole formed therethrough, a lead extending through the through hole, and a sealing part configured to seal the through hole around the lead, wherein a main material of the eyelet is 45% Ni—Fe, and wherein a thermal expansion coefficient of the eyelet is greater than a thermal expansion coefficient of the sealing part.

Stem for semiconductor package including eyelet and lead

A stem includes a base member that includes a main body, a raised portion raised from the top surface of the main body, and a through-hole through the main body, a lead that is inserted into the through-hole of the base member and is fixed to the through-hole with a fixing material such that one end of the lead juts out of the top surface of the main body of the base member, and a substrate that is inserted into a gap between the raised portion of the base member and one end of the lead and is attached to the raised portion to be electrically connected to the one end. The lead has a curved surface curving in a direction widening the gap into which the substrate is inserted, or an inclined surface inclined in a direction widening the gap, on a tip of the one end.

Stem

A package for an optical semiconductor device includes an eyelet, a signal lead inserted in a through hole formed in the eyelet, and sealing glass sealing the signal lead in the through hole. The signal lead includes a first portion, a second portion and a third portion that are greater in diameter than the first portion and on opposite sides of the first portion, a first tapered portion extending from the second portion to the first portion, and a second tapered portion extending from the third portion to the first portion. The first portion and the first and second tapered portions are buried in the sealing glass. The total length of a part of the second portion in the sealing glass and a part of the third portion in the sealing glass is 0.2 mm or less.

Growing community of inventors

Nagano, Japan

Masao Kainuma