This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Ebara Corporation. Active years: 2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2011
Title: Masanori Hayase: Innovator in Substrate Plating Technology
Introduction
Masanori Hayase is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of substrate plating technology. His innovative methods have paved the way for advancements in metal plating processes.
Latest Patents
Masanori Hayase holds a patent for a substrate plating method and apparatus. This method allows for the uniform plating of metals, such as copper or copper alloys, into fine recesses in a substrate without forming voids. The process involves first plating the surface in a solution containing a plating accelerator, followed by a removal process to eliminate the accelerator, and concluding with a second plating at a constant electric potential.
Career Highlights
Hayase is associated with Ebara Corporation, where he has been instrumental in developing advanced plating technologies. His work has been recognized for its impact on manufacturing processes, particularly in the electronics industry.
Collaborations
Masanori Hayase has collaborated with notable colleagues, including Yasuhiko Saijo and Keisuke Hayabusa. Their combined expertise has contributed to the success of various projects within the company.
Conclusion
Masanori Hayase's innovative approach to substrate plating has established him as a key figure in the field. His patent reflects a significant advancement in technology that benefits various industries.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile