Masahisa Kogura

Title: Innovations of Masahisa Kogura

Introduction

Masahisa Kogura is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of ultrasonic bonding technology. With a total of two patents to his name, Kogura's work focuses on enhancing manufacturing processes and improving material bonding techniques.

Latest Patents

Kogura's latest patents include an ultrasonic bonding tool and a method for manufacturing this tool. The ultrasonic bonding tool is designed to bond lead wires to thin-film bases, such as glass substrates, with a thickness of 2 mm or less. The innovative design features a surface portion of the tool that includes multiple planar portions separated by concavities, ensuring a flatness of 2 micrometers or less. Additionally, he has developed a method for forming zinc oxide (ZnO) and magnesium zinc oxide (ZnMgO) films, which emphasizes high transmittance. This method involves converting a solution containing zinc or zinc and magnesium into mist, heating a substrate, and supplying the mist and ozone to the substrate's surface.

Career Highlights

Kogura is currently employed at Toshiba Mitsubishi-Electric Industrial Systems Corporation, where he continues to advance his research and development efforts. His work has been instrumental in improving ultrasonic bonding techniques, which are crucial in various manufacturing applications.

Collaborations

Kogura has collaborated with notable colleagues, including Akio Yoshida and Takahiro Shirahata. Their combined expertise has contributed to the successful development of innovative technologies in their field.

Conclusion

Masahisa Kogura's contributions to ultrasonic bonding technology and his innovative patents reflect his dedication to advancing manufacturing processes. His work continues to influence the industry and pave the way for future innovations.