The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Jan. 11, 2016
Toshiba Mitsubishi-electric Industrial Systems Corporation, Minato-ku, JP;
Akio Yoshida, Tokyo, JP;
Masahisa Kogura, Tokyo, JP;
Abstract
An object of the present invention is to provide an ultrasonic bonding tool capable of bonding a lead wire, without any trouble, even to a surface of a thin-film base having a plate thickness of 2 mm or less such as a glass substrate. In the present invention, a surface portion of a chip portion () of an ultrasonic bonding tool () used in an ultrasonic bonding apparatus has a plurality of planar portions () formed so as to be separated from one another, and a plurality of concavities () formed between the plurality of planar portions. Each of the plurality of planar portions () has a flatness of 2 μm or less.