This inventor holds 3 USPTO granted patents and 2 EPO patents. Top assignees: Tamura Corporation, Japan Science and Technology Agency. Active years: 2008-2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
3 out of 196 
2 out of 1,328 
Years Active: 2008-2012
Title: Innovations of Masahiko Furuno in Heating Devices
Introduction
Masahiko Furuno is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of heating devices, particularly in the area of solder bump formation. With a total of 3 patents, his work has advanced the technology used in electronic manufacturing.
Latest Patents
Furuno's latest patents include a heating device, a reflow device, a heating method, and a bump forming method. His innovative heating device features a lid structure that blocks hot air from directly blowing against a solder composition. This design effectively reduces the contact of high-temperature oxygen molecules with the solder, thereby suppressing oxidation. As a result, a solder bump can be formed using a liquid-like solder composition. The uniform heating provided by the lid structure ensures that the container is heated evenly, preventing the scattering of the liquid-like solder composition.
Another significant patent involves an apparatus where a substrate or jig is heated by blowing hot air from below. This method allows for the formation of solder bumps on pad electrodes by heating a solder composition that includes solder particles, a flux component, and a liquid material. The design prevents oxidation of the solder paste and enhances the adhesion of particles to the substrate, ensuring a more efficient soldering process.
Career Highlights
Furuno has worked with reputable organizations such as Tamura Corporation and the Japan Science and Technology Agency. His experience in these companies has contributed to his expertise in developing advanced heating technologies.
Collaborations
Some of his notable coworkers include Junichi Onozaki and Isao Sakamoto. Their collaboration has likely played a role in the successful development of his innovative patents.
Conclusion
Masahiko Furuno's contributions to heating devices and solder bump formation have significantly impacted the electronics industry. His innovative approaches continue to influence the development of efficient manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile