The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Dec. 13, 2002
Junichi Onozaki, Tokyo, JP;
Masahiko Furuno, Tokyo, JP;
Hiroshi Saito, Tokyo, JP;
Haruhiko Andou, Tokyo, JP;
Isao Sakamoto, Tokyo, JP;
Masaru Shirai, Tokyo, JP;
Yuji Ohashi, Saitama, JP;
Junichi Onozaki, Tokyo, JP;
Masahiko Furuno, Tokyo, JP;
Hiroshi Saito, Tokyo, JP;
Haruhiko Andou, Tokyo, JP;
Isao Sakamoto, Tokyo, JP;
Masaru Shirai, Tokyo, JP;
Yuji Ohashi, Saitama, JP;
Tamura Corporation, Tokyo, JP;
Japan Science and Technology Agency, Saitama, JP;
Abstract
Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containing solder fine particles is fed from a solder fine particle forming unit to the liquid tank and the solder fine particles are dropped from a supply pipe onto the substrate in the inert liquid. The solder fine particles naturally fall down by the gravity, thereby reaching the substrate. The solder fine particles reached on the pad electrodes on the substrate stay there due to the gravity, and spread on the surfaces of the pad electrodes after the solder wet time, thereby forming solder coating.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile