This inventor holds 1 USPTO granted patent. Top assignees: Japan Science and Technology Agency, Tamura Corporation. Active years: 2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 1,329 
1 out of 196 
Years Active: 2008
Title: Yuji Ohashi: Innovator in Solder Supply Methods
Introduction
Yuji Ohashi is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of solder supply methods, particularly with his innovative approach to fine-pitched pad electrodes and solder bumps. His work has implications for various electronic manufacturing processes.
Latest Patents
Ohashi holds a patent for a "Method for supplying solder." This invention involves positioning a substrate in an inert liquid, allowing solder fine particles to be fed from a forming unit. The particles naturally fall onto the substrate due to gravity, where they spread on the pad electrodes after a designated wet time, forming a solder coating. This method ensures a large amount of solder with minimal variation in quantity.
Career Highlights
Throughout his career, Yuji Ohashi has worked with prominent organizations, including Tamura Corporation and the Japan Science and Technology Agency. His experience in these companies has allowed him to refine his skills and contribute to advancements in solder technology.
Collaborations
Ohashi has collaborated with notable colleagues such as Junichi Onozaki and Isao Sakamoto. These partnerships have fostered innovation and development in his field.
Conclusion
Yuji Ohashi's contributions to solder supply methods highlight his role as an influential inventor in the electronics industry. His patented method showcases his innovative thinking and dedication to improving manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile