The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Mar. 22, 2006
Junichi Onozaki, Tokyo, JP;
Masahiko Furuno, Tokyo, JP;
Hiroshi Saito, Tokyo, JP;
Isao Sakamoto, Tokyo, JP;
Masaru Shirai, Tokyo, JP;
Junichi Onozaki, Tokyo, JP;
Masahiko Furuno, Tokyo, JP;
Hiroshi Saito, Tokyo, JP;
Isao Sakamoto, Tokyo, JP;
Masaru Shirai, Tokyo, JP;
Tamura Corporation, Tokyo, JP;
Abstract
A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile