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For the Inventor, By the Inventor

Nagano, Japan

Masaharu Ishizuka

This inventor holds 5 USPTO granted patents. Top assignee: Tdk Corporation. Active years: 1995-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masaharu Ishizuka. Retrieved from https://idiyas.com/inventor/masaharu-ishizuka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5

% Patents Active = 60.0

Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 43(Granted Patents)


Location History:

  • Tokyo, JP (1995)
  • Nagano, JP (1998 - 2010)
  • Toumi, JP (2011)

Company Filing History:

goldMedal5 out of 8,267 
 
Tdk Corporation
 patents

Years Active: 1995-2011

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5 patents (USPTO):Explore Patents
1. 7868435 - Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same (2011-01-11),
2. 7645685 - Method for producing a thin IC chip using negative pressure (2010-01-12),
3. 7419885 - Method for cutting a wafer using a protection sheet (2008-09-02),
4. 5732459 - Method for fixing a magnetic head slider with a slider support member (1998-03-31),
5. 5384432 - Two-layered tape lead wire for magnetic head (1995-01-24),

Title: Masaharu Ishizuka: Innovator in Adhesive Technology

Introduction

Masaharu Ishizuka is a prominent inventor based in Nagano, Japan. He has made significant contributions to the field of adhesive technology, holding a total of 5 patents. His work focuses on innovative methods and materials that enhance the bonding process in various applications.

Latest Patents

Ishizuka's latest patents include an adhesive containing a filler and a method for attaching and manufacturing a thin plate using the same. The adhesive comprises a base material that generates adhesive strength through curing, a hardening agent that promotes the curing of the base material, and a filler made of particles with a maximum diameter of 0.8 µm or less. Another notable patent is a method for producing a thin IC chip using negative pressure. This method involves bonding two thin plates using an adhesive, applying negative pressure to hold the plates in place, and curing the adhesive to achieve a strong bond.

Career Highlights

Masaharu Ishizuka is associated with TDK Corporation, where he has been instrumental in advancing adhesive technologies. His innovative approaches have led to improved manufacturing processes and enhanced product performance in the electronics industry.

Collaborations

Ishizuka has collaborated with notable colleagues, including Shigeru Shoji and Nobuya Ohyama. Their combined expertise has contributed to the development of cutting-edge adhesive solutions.

Conclusion

Masaharu Ishizuka's contributions to adhesive technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials and processes that are essential for modern manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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