Tdk Corporation

Masaharu Ishizuka

Shigeru Shoji

Masashi Shiraishi

Hiroshi Kanai

Nobuya Ohyama

Masahiko Itoh

Noboru Shinohara

An adhesive comprises a base material which generates adhesive strength through curing, a hardening agent which promotes the curing of the base material, and a filler. In order to solve the problems mentioned above, the adhesive is made of particles having a maximum particle diameter of 0.8 &#x3bc;m or less.

Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same

The present invention relates to a method for bonding a first thin plate having a first adhesion surface and a first back surface and a second thin plate having a second adhesion surface and a second back surface by an adhesive, the adhesive being sandwiched between said first adhesion surface and said second adhesion surface. The method comprises the steps of: applying said adhesive to said second adhesion surface of said second thin plate; holding said first thin plate by applying negative pressure to said first back surface, wherein said first thin plate is held at said first back surface, and said first adhesion surface faces downward; holding said second thin plate by applying negative pressure to said second back surface, wherein said second thin plate is held at said second back surface, and said second adhesion surface faces upward; temporarily bonding said first thin plate and said second thin plate by putting said first and second adhesion surfaces into contact with each other, wherein said first thin plate and said second thin plate are held by negative pressure; and bonding said first thin plate and said second thin plate by curing said adhesive, wherein said first thin plate and said second thin plate are temporarily bonded.

Method for producing a thin IC chip using negative pressure

The method for dicing a wafer including the steps of: reducing a thickness of a wafer to at least 0.1mm or less; forming a protection sheet tightly on one side of the wafer, the protection sheet having a Vickers hardness of 2 or more; and dicing the wafer by a grindstone, the wafer having the protection sheet thereon.

Method for cutting a wafer using a protection sheet

A method for fixing members includes a step of inserting a conductive thermosetting adhesive between the members to be bonded with each other, and a step of flowing a current directly through the conductive thermosetting adhesive so that the adhesive is cured itself due to Joule effect caused by the current flowed through the adhesive.

Method for fixing a magnetic head slider with a slider support member

A tape lead wire includes a polymer resin film and conductor films. The conductor films are directly deposited on the surface of the polymer resin film without using any bonding layer. The total thickness of the tape lead wire can be made smaller than that of a conventional lead wire. The tape lead wire has a high flexibility, can be easily bent, can extremely reduce the bending spring rigidity and is suitable for a magnetic head having a reduced size and load, which is imposed by a head supporting device on the magnetic head, and lowered flying height and peripheral speed.

Growing community of inventors

Nagano, Japan

Masaharu Ishizuka