The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 1995
Filed:
May. 28, 1993
Tetsuya Noro, Tokyo, JP;
Masahiko Itoh, Sagamihara, JP;
Nobuya Ohyama, Tokyo, JP;
Hiroshi Kanai, Tokyo, JP;
Masaharu Ishizuka, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A tape lead wire includes a polymer resin film and conductor films. The conductor films are directly deposited on the surface of the polymer resin film without using any bonding layer. The total thickness of the tape lead wire can be made smaller than that of a conventional lead wire. The tape lead wire has a high flexibility, can be easily bent, can extremely reduce the bending spring rigidity and is suitable for a magnetic head having a reduced size and load, which is imposed by a head supporting device on the magnetic head, and lowered flying height and peripheral speed.