Masafumi Miyakawa

Title: Masafumi Miyakawa: Innovator in Semiconductor Wafer Protection

Introduction

Masafumi Miyakawa is a notable inventor based in Nagoya, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the protection of semiconductor wafers. With a total of 3 patents to his name, his work addresses critical challenges in the semiconductor manufacturing process.

Latest Patents

Miyakawa's latest patents include a method of protecting semiconductor wafers and an adhesive film designed for this purpose. The first patent outlines a comprehensive method that involves adhering an adhesive film to the circuit-formed surface of a semiconductor wafer. This method includes several steps: heating the wafer, processing the non-circuit-formed surface, and finally peeling off the adhesive film. This innovative approach effectively addresses warpage issues and prevents breakage during conveyance, even for wafers as thin as approximately 150 µm.

The second patent focuses on a pressure-sensitive adhesive film that protects the surface of semiconductor wafers. This film features an adhesive layer with specific elastic modulus properties and thickness, ensuring that the semiconductor wafer remains intact and uncontaminated during the grinding process. This invention is particularly beneficial for wafers thinned to as low as 100 µm.

Career Highlights

Miyakawa is currently employed at Mitsui Chemicals, Inc., where he continues to develop innovative solutions in semiconductor technology. His expertise and dedication to improving wafer protection methods have positioned him as a key figure in the industry.

Collaborations

Miyakawa has collaborated with notable colleagues, including Makoto Kataoka and Yoshihisa Saimoto. Their combined efforts contribute to advancing semiconductor technology and enhancing the efficiency of wafer processing.

Conclusion

Masafumi Miyakawa's contributions to semiconductor wafer protection demonstrate his commitment to innovation in the field. His patents not only address critical manufacturing challenges but also pave the way for advancements in semiconductor technology.