The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2007
Filed:
Mar. 26, 2003
Yoshihisa Saimoto, Nagoya, JP;
Makoto Kataoka, Sodegaura, JP;
Masafumi Miyakawa, Nagoya, JP;
Shinichi Hayakawa, Nagoya, JP;
Kouji Igarashi, Nagoya, JP;
Yoshihisa Saimoto, Nagoya, JP;
Makoto Kataoka, Sodegaura, JP;
Masafumi Miyakawa, Nagoya, JP;
Shinichi Hayakawa, Nagoya, JP;
Kouji Igarashi, Nagoya, JP;
Mitsui Chemicals, Inc., Tokyo, JP;
Abstract
The present invention relates to a surface protecting adhesive film for a semiconductor wafer in which an adhesive layer having a storage elastic modulus from 1×10Pa to 1×10Pa at 150° C. and a thickness of from 3 μm to 100 μm is formed on both a surface and back surface of a base film having a melting point of at least 200° C. and a thickness of 10 μm to 200 μm. According to the present invention, in a step of grinding the back side of a semiconductor wafer and removing a damaged layer generated on the back side, the semiconductor wafer can be prevented from being broken and being contaminated and the like even if a semiconductor wafer is thinned as low as 100 μm.