Kitakyushu, Japan

Masafumi Miyagawa


Average Co-Inventor Count = 4.0

ph-index = 3

Forward Citations = 100(Granted Patents)


Location History:

  • Kitakyushu, JP (1984 - 1986)
  • Sagamihara, JP (1986)

Company Filing History:


Years Active: 1984-1986

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3 patents (USPTO):Explore Patents

Title: Masafumi Miyagawa: Innovator in Semiconductor Technology

Introduction

Masafumi Miyagawa is a prominent inventor based in Kitakyushu, Japan. He has made significant contributions to the field of semiconductor technology, holding three patents that showcase his innovative approach to solving complex engineering challenges.

Latest Patents

Miyagawa's latest patents include a method of dicing a semiconductor wafer and a semiconductor device that monolithically comprises a V-MOSFET and bipolar elements. The method of dicing a semiconductor wafer involves forming a physical discontinuity on the surface of the wafer on both sides of a dicing line. This technique limits the spreading of cracks and chips generated during the dicing process. The semiconductor device patent features a high voltage withstanding vertical MOSFET and a low voltage withstanding element, both formed on a single chip. This design incorporates buried layers of high impurity concentration, which help reduce the series resistance of a circuit adjacent to the vertical MOSFET without compromising its withstand voltage.

Career Highlights

Miyagawa is currently employed at Tokyo Shibaura Denki Kabushiki Kaisha, a company known for its advancements in electrical and electronic equipment. His work has significantly impacted the semiconductor industry, particularly in enhancing device performance and reliability.

Collaborations

Some of his notable coworkers include Toshio Yonezawa and Shunichi Hiraki, who have collaborated with him on various projects within the semiconductor field.

Conclusion

Masafumi Miyagawa's innovative contributions to semiconductor technology demonstrate his expertise and commitment to advancing the industry. His patents reflect a deep understanding of the challenges faced in semiconductor manufacturing and provide effective solutions that enhance device functionality.

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