Martin Hierholzer

Title: Martin Hierholzer: Innovator in Semiconductor Technology

Introduction

Martin Hierholzer is a notable inventor based in Moehnesee, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Among his latest patents is a semiconductor circuit arrangement. This invention discloses a method where a semiconductor module is attached to a board using a screw. This design allows for simultaneous mechanical and electrical contact between the module contacts and the associated board contacts. Another significant patent is for a power semiconductor module. This module features a ceramic substrate with patterned metallization and includes a first semiconductor chip with a power semiconductor component. Additionally, it incorporates a second semiconductor chip with drive electronics, enhancing the overall performance of the module.

Career Highlights

Martin Hierholzer has worked with prominent companies in the semiconductor industry, including Infineon Technologies AG and Eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG. His experience in these organizations has contributed to his expertise and innovative capabilities in semiconductor technology.

Collaborations

Throughout his career, Martin has collaborated with talented individuals such as Patrick Baginski and Michael Hornkamp. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Martin Hierholzer's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the industry positively.