The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2010
Filed:
May. 31, 2007
Applicants:
Martin Hierholzer, Moehnesee, DE;
Patrick Baginski, Oelde, DE;
Michael Hornkamp, Waltringen, DE;
Uwe Jansen, Werl, DE;
Inventors:
Martin Hierholzer, Moehnesee, DE;
Patrick Baginski, Oelde, DE;
Michael Hornkamp, Waltringen, DE;
Uwe Jansen, Werl, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor circuit arrangement is disclosed. In one embodiment, a semiconductor module is attached to a board using a screw, with a mechanical and electrical contact being made between module contacts on the semiconductor module and associated board contacts on the board at the same time by attachment using the screw.