The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2009
Filed:
Jul. 28, 2006
Martin Hierholzer, Moehnesee, DE;
Martin Hierholzer, Moehnesee, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A power semiconductor module has a ceramic substrate () which has on at least one side a patterned metallization () with a fineness of pattern of smaller than or equal to 800 μm, a first semiconductor chip () which has a power semiconductor component and which is arranged on the patterned metallization (), and a second semiconductor chip () which has drive electronics for driving the first semiconductor chip () and which is arranged on the patterned metallization (). Furthermore, at least one thin-wire bond () with a bonding-wire diameter (d, d) of smaller than or equal to 75 μm is provided which is formed between the patterned metallization () and the second semiconductor chip ().