Munich, Germany

Martin Franosch

USPTO Granted Patents = 48 


Average Co-Inventor Count = 3.9

ph-index = 9

Forward Citations = 411(Granted Patents)


Location History:

  • Munchen, DE (1998 - 2000)
  • München, DE (2001 - 2012)
  • Munich, DE (1999 - 2020)

Company Filing History:


Years Active: 1998-2020

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48 patents (USPTO):

Title: Martin Franosch - Pioneering Innovator in Microelectronics

Introduction:

Martin Franosch, a distinguished inventor based in Munich, Germany, has made significant contributions to the field of microelectronics. With an impressive portfolio of 48 patents, Franosch has revolutionized the industry with his groundbreaking inventions.

Latest Patents:

Among his latest patents is the "Polymer lid wafer-level package with an electrically and thermally conductive pillar." This innovative apparatus features a unique design that enhances electrical and thermal conductivity in electronic packaging. Another notable patent is the "Method for housing an electronic component in a device package," showcasing Franosch's expertise in creating efficient housing solutions for electronic components.

Career Highlights:

Throughout his career, Martin Franosch has worked with leading companies in the industry, including Infineon Technologies AG and Siemens Aktiengesellschaft. His invaluable contributions have helped these organizations stay at the forefront of technological advancements in microelectronics.

Collaborations:

Franosch has collaborated with esteemed professionals in the field, such as Reinhard J Stengl and Hans Reisinger. These partnerships have led to the development of pioneering technologies that have reshaped the landscape of microelectronics.

Conclusion:

In conclusion, Martin Franosch stands out as a visionary inventor whose innovative solutions have had a lasting impact on the field of microelectronics. His impressive patent portfolio and collaborations with industry experts underscore his dedication to pushing the boundaries of technological innovation.

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