The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 2010

Filed:

Jan. 11, 2008
Applicants:

Alfred Martin, Munich, DE;

Barbara Hasler, Munich, DE;

Martin Franosch, Munich, DE;

Klaus-guenter Oppermann, Holzkirchen, DE;

Inventors:

Alfred Martin, Munich, DE;

Barbara Hasler, Munich, DE;

Martin Franosch, Munich, DE;

Klaus-Guenter Oppermann, Holzkirchen, DE;

Assignee:

Qimonda AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit that comprises a substrate and a structured layer on the substrate. The structured layer comprises an opening to the substrate, a first field and a second field on the substrate, wherein the first field and the second field, at least in part, overlap with the opening. The integrated circuit further comprises a first material in the area of the first field and a second material in the area of the second field. The first material impedes a wetting by a solder material, and the second provides a wetting by the solder material.


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