Boise, ID, United States of America

Mario J Di Cino


 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020-2022

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3 patents (USPTO):

Title: Innovations of Mario J Di Cino

Introduction

Mario J Di Cino is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of integrated circuitry, holding a total of 3 patents. His work focuses on advanced methods and systems that enhance the functionality and efficiency of memory arrays.

Latest Patents

Di Cino's latest patents include innovative techniques for integrated circuits. One of his patents describes a method of forming an array that utilizes two different composition masking materials to create a pattern of spaced repeating features. This method introduces a pattern-interrupting feature that varies in size or shape, which is crucial for improving the accuracy of memory arrays. Another patent addresses the determination of overlay of features in a memory array, detailing methods for forming conductive lines and contacts that enhance the performance of electronic devices.

Career Highlights

Mario J Di Cino is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His expertise in integrated circuitry has positioned him as a valuable asset to the organization. His innovative approaches have contributed to advancements in memory technology, making significant impacts in the field.

Collaborations

Di Cino has collaborated with talented coworkers such as Gurpreet S Lugani and Kyle B Campbell. Their combined efforts have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Mario J Di Cino's contributions to integrated circuitry and memory technology exemplify the spirit of innovation. His patents reflect a commitment to advancing the field and improving electronic devices.

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