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For the Inventor, By the Inventor

Au, Switzerland

Mario Cesana

This inventor holds 20 USPTO granted patents and 2 published patent applications and 3 EPO patents, primarily in Optoelectronic Modules. Top assignees: Ams Sensors Singapore Pte. Ltd., Heptagon Micro Optics Pte. Ltd., Ams Sensors Asia Pte. Ltd.. Active years: 2013-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mario Cesana. Retrieved from https://idiyas.com/inventor/mario-cesana

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20 

% Patents Active = 95.0

 

Average Co-Inventor Count = 5.1

ph-index = 4

Forward Citations = 35(Granted Patents)


Location History:

  • Singapore, SG (2023)
  • Au, CH (2013 - 2024)

Company Filing History:

goldMedal12 out of 151 
 
Ams Sensors Singapore Pte. Ltd.
 patents
silverMedal7 out of 105 
 
Heptagon Micro Optics Pte. Ltd.
 patents
bronzeMedal1 out of 16 
 
Ams Sensors Asia Pte. Ltd.
 patents

Years Active: 2013-2025

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Areas of Expertise:
Light Emitting Module
Thermal Management
Opto-Electronic Modules
Image Sensor Modules
Silicon Substrate
Focal Length Adjustment
Transceiver Module
Locking Assemblies
Molded Circuit Substrates
Beam Shaping Elements
Optical Assembly
Non-Circular Lens
20 patents (USPTO):Explore Patents
1. 12489097 - Light emitting module combining enhanced safety features and thermal management (2025-12-02),
2. 11942580 - Compact opto-electronic modules and fabrication methods for such modules (2024-03-26),
3. 11662541 - Optoelectronic modules having locking assemblies and methods for manufacturing the same (2023-05-30),
4. 11575843 - Image sensor modules including primary high-resolution imagers and secondary imagers (2023-02-07),
5. 11145796 - Compact opto-electronic modules and fabrication methods for such modules (2021-10-12),
6. 11013123 - Molded circuit substrates (2021-05-18),
7. 10872999 - Optoelectronic module having dual encapsulation with opening for receiving an optical assembly (2020-12-22),
8. 10771714 - Image sensor modules including primary high-resolution imagers and secondary imagers (2020-09-08),
9. 10741736 - Compact opto-electronic modules and fabrication methods for such modules (2020-08-11),
10. 10680023 - Optoelectronic modules having a silicon substrate, and fabrication methods for such modules (2020-06-09),
11. 10547385 - Transceiver module including optical sensor at a rotationally symmetric position (2020-01-28),
12. 10373996 - Optical modules including focal length adjustment and fabrication of the optical modules (2019-08-06),
13. 10283542 - Optoelectronic modules having a silicon substrate, and fabrication methods for such modules (2019-05-07),
14. 10101555 - Camera module including a non-circular lens (2018-10-16),
15. 9977153 - Stacks of arrays of beam shaping elements including stacking, self-alignment and/or self-centering features (2018-05-22),

Title: Inventor Mario Cesana

Introduction: Mario Cesana is a renowned inventor based in Au, Switzerland. He is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Mario Cesana holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies. His recent patents focus on enhancing efficiency and sustainability in various industries.

Career Highlights: With a career spanning over two decades, Mario Cesana has worked with leading tech companies to develop cutting-edge solutions. He has been instrumental in the creation of innovative products that have revolutionized the way we approach modern challenges.

Collaborations: Mario Cesana has collaborated with top researchers, engineers, and scientists from around the world to bring his ideas to life. His collaborative efforts have resulted in successful projects that have had a significant impact on the tech industry.

Conclusion: Mario Cesana's passion for innovation and his dedication to pushing the boundaries of technology have solidified his reputation as a visionary inventor in the global innovation landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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