Ams Sensors Singapore Pte. Ltd.

Heptagon Micro Optics Pte. Ltd.

Mario Cesana

Hartmut Rudmann

Markus Rossi

Jens Geiger

Peter Roentgen

Jukka Alasirnio

Simon Gubser

Stephan Heimgartner

Nicola Spring

Robert Lenart

Vincenzo Condorelli

Alexander Bietsch

Bassam Hallal

Ohad Meitav

Ville Kettunen

Moshe Doron

Bojan Tesanovic

Florin Cutu

Tobias Senn

Alireza Yasan

Jukka Alasirniö

Camilla Camarri

Daniel Perez Calero

Kai Engelhardt

Philippe Bouchilloux

Susanne Westenhoefer

Nicole Ebentheuer

Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

Compact opto-electronic modules and fabrication methods for such modules

This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.

Optoelectronic modules having locking assemblies and methods for manufacturing the same

Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

Image sensor modules including primary high-resolution imagers and secondary imagers

Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.

Molded circuit substrates

An optoelectronic module includes first and second optical channels having respective active optoelectronic components. A transparent encapsulation is over the active optoelectronic components, and opaque encapsulation is on the transparent encapsulation. The opaque encapsulation has a first opening over a first active optoelectronic component and a second opening over a second optoelectronic component. The opaque encapsulation forms a ledge in an area of the second opening, and an optical assembly is disposed on the ledge within the second opening over the second optoelectronic component.

Optoelectronic module having dual encapsulation with opening for receiving an optical assembly

Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.

Optoelectronic modules having a silicon substrate, and fabrication methods for such modules

An optoelectronic module includes a transceiver operable to transmit data optically. The transceiver includes a light emitter to emit light from the module, and a light detector to detect light entering the module. The light detector is disposed at a rotationally symmetric position with respect to a central axis of the module. Such modules can help facilitate the exchange of data optically between two devices.

Transceiver module including optical sensor at a rotationally symmetric position

Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

Optical modules including focal length adjustment and fabrication of the optical modules

Camera modules include a lens, a lens stack and/or an array of lenses. One or more of the lenses have a non-circular shape, which in some cases can provide greater flexibility in the dimensions of the module and can result in a very small camera module.

Camera module including a non-circular lens

Various stacks of arrays of beam shaping elements are described. Each array of beam shaping elements can be formed, for example, as part of a monolithic piece that includes a body portion as well as the beam shaping elements. In some implementations, the monolithic pieces may be formed, for example, as integrally formed molded pieces. The monolithic pieces can include one or more features to facilitate stacking, aligning and/or centering of the arrays with respect to one another.

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Au, Switzerland

Mario Cesana