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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11942580 B1

PDFFull Text
Date of Patent:
Mar. 26, 2024

Filed:

Oct. 11, 2021

Compact opto-electronic modules and fabrication methods for such modules

Applicant:

Ams Sensors Singapore Pte. Ltd., Singapore, SG;

Inventors:

Simon Gubser, Weesen, CH;

Mario Cesana, Au, CH;

Markus Rossi, Jona, CH;

Hartmut Rudmann, Jona, CH;

Assignee:

ams Sensors Singapore Pte. Ltd., Singapore, SG;

Attorney:

MICHAEL BEST & FRIEDRICH LLP;

Primary Examiner:

Mohammad M Hoque

Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 31/0216 (2014.01); H01L 31/0232 (2014.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01); H01S 5/02 (2006.01); H01S 5/183 (2006.01); H10K 50/84 (2023.01); H10K 50/858 (2023.01); H10K 71/00 (2023.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 24/97 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14685 (2013.01); H01L 31/0203 (2013.01); H01L 31/02164 (2013.01); H01L 31/02327 (2013.01); H01L 31/186 (2013.01); H01L 33/0095 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01S 5/02 (2013.01); H01S 5/183 (2013.01); H10K 50/84 (2023.02); H10K 50/858 (2023.02); H10K 71/00 (2023.02); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01);
Abstract

Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

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