Maria V Henao

Title: Maria V Henao: Innovator in Microelectronic Packaging

Introduction

Maria V Henao is a prominent inventor based in Pleasanton, California. She has made significant contributions to the field of microelectronics, holding two patents that showcase her innovative spirit and technical expertise. Her work primarily focuses on the development of advanced microelectronic packages, which are essential for modern electronic devices.

Latest Patents

Maria's latest patents include an integrated core microelectronic package. This invention features a microelectronic die that is strategically placed within an opening in a microelectronic packaging core. An encapsulation material is utilized to fill the portions of the opening that are not occupied by the microelectronic die. Additionally, build-up layers of dielectric materials and conductive traces are fabricated on the microelectronic die, the encapsulant material, and the microelectronic package core to create a fully functional microelectronic package.

Career Highlights

Maria is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. Her role at Intel allows her to work on cutting-edge technologies that drive the future of electronics.

Collaborations

Throughout her career, Maria has collaborated with talented individuals such as Quat T Vu and Jian Li. These collaborations have further enhanced her work and contributed to the success of her projects.

Conclusion

Maria V Henao is a remarkable inventor whose contributions to microelectronic packaging are noteworthy. Her patents reflect her dedication to innovation and her role in advancing technology in the electronics industry.