Intel Corporation

Maria V Henao

Qing Ma

Jian Li

Quat T Vu

Xiao-Chun Mu

Chun Mu

A microelectronic package including a microelectronic die disposed within an opening in a microelectronic packaging core, wherein an encapsulation material is disposed within portions of the opening not occupied by the microelectronic die. Build-up layers of dielectric materials and conductive traces are then fabricated on the microelectronic die, the encapsulant material, and the microelectronic package core to form the microelectronic package.

Growing community of inventors

Pleasanton, CA, United States of America

Maria V Henao