Company Filing History:

9 out of 12,867

Advanced Micro Devices Corporation

patents

2 out of 49

Lightwave Microsystems Corporation

patents

Years Active: 2000-2004

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6812570 - Organic packages having low tin solder connections (2004-11-02),

2. 6722553 - Controlled and programmed deposition of flux on a flip-chip die by spraying (2004-04-20),

3. 6671450 - Apparatus and method to metallize, reinforce, and hermetically seal multiple optical fibers (2003-12-30),

4. 6617195 - Method of reflowing organic packages using no-clean flux (2003-09-09),

5. 6603916 - Lightwave circuit assembly having low deformation balanced sandwich substrate (2003-08-05),

6. 6488158 - Boat for organic and ceramic flip chip package assembly (2002-12-03),

7. 6468917 - Method for modifying a C4 semiconductor device (2002-10-22),

8. 6409070 - Minimizing flux residue by controlling amount of moisture during reflow (2002-06-25),

9. 6382500 - Solder reflow furnace with flux effluent collector and method of preventing flux contamination (2002-05-07),

10. 6103549 - No clean flux for flip chip assembly (2000-08-15),

11. 6098867 - Automated brush fluxing system for application of controlled amount of (2000-08-08),

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Company Filing History:

Years Active: 2000-2004