The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2004
Filed:
Jun. 28, 2002
Applicant:
Inventors:
Raj N. Master, San Jose, CA (US);
Mohammad Zubair Khan, San Jose, CA (US);
Maria Guardado, San Jose, CA (US);
Charles Anderson, Los Altos, CA (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H05K 9/00 ; H05K 1/09 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H05K 9/00 ; H05K 1/09 ;
Abstract
An organic carrier member for mounting a semiconductor device is provided that has a plurality of solder pads containing low amounts of tin and bismuth. Embodiments include a bismaleimide-triazine epoxy laminate having a plurality of solder pads on the surface thereof where the solder pads contain no more than about 20 weight percent tin and has a reflow temperature of no greater than about 270° C.
Master, Raj. (2004). Organic packages having low tin solder connections (U.S. Patent No. 6812570). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6812570
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile