Advanced Micro Devices Corporation

Lightwave Microsystems Corporation

Maria G Guardado

Raj N Master

Mohammad Zubair Khan

Mohammad A Khan

Kenneth McGreer

Susan Xia Li

Charles Anderson

Arnold Y Louie

Peter D Ascanio

Ooi Tong Ong

Orion K Starr

Ahmad Juwanda

Randal Edward Zugnoni

Rickquel B Garcia

Diong Hing Ding

Junaida Abu Bakar

Sofi Mohd

Sp Lee

Loo L Teoh

An organic carrier member for mounting a semiconductor device is provided that has a plurality of solder pads containing low amounts of tin and bismuth. Embodiments include a bismaleimide-triazine epoxy laminate having a plurality of solder pads on the surface thereof where the solder pads contain no more than about 20 weight percent tin and has a reflow temperature of no greater than about 270&deg; C.

Organic packages having low tin solder connections

A method and apparatus are provided for controllably dispensing flux on a substrate having a plurality of conductive terminals. Flux having a viscosity range between 10 centipoises and about 150 centipoises is sprayed on the substrate and the conductive terminals at a valve pressure range between about 1.5 psi and about 30 psi via a dispense nozzle of a flux dispenser. Upon a subsequent high temperature solder reflow process, the sprayed flux on the substrate is mostly removed by thermal decomposition to volatile species, thereby significantly reducing flux residue remaining on the surface of the substrate between the conductive terminals.

Controlled and programmed deposition of flux on a flip-chip die by spraying

Apparatus and methods to metallize, reinforce, and hermetically seal multiple optical fibers are described herein. A ribbon of optical fibers may be placed into a fixture to expose a mid-span segment for removal of the coatings from the optical fibers by acid etching, laser, etc. A variety of metallic coatings may then be deposited onto the bare segment of the optical fibers. The metallized segment of optical fibers are then deposited with solderable alloy onto a plate for attachment to the plate for reinforcement of the metallized segment. The plate and metallized segment is then fed through a package opening and hermetically sealed to internally connect one or more components inside the package by heating the package to melt additional solder around the opening or gap. Epoxy is then applied over the solder to help protect the solder and additionally seal the package.

Apparatus and method to metallize, reinforce, and hermetically seal multiple optical fibers

A method of manufacturing a semiconductor device by attaching a flip chip die to an organic substrate using solder comprises applying no-clean flux to the flip chip die or the organic substrate; heating the flip chip die and the organic substrate to bond the flip chip die to the organic substrate, and cooling the flip chip die and the organic substrate. The step of heating the flux includes controlling oxygen and moisture content of an atmosphere surrounding the flux, preheating to a temperature of about 145&deg; C. to about 165&deg; C., soaking at a temperature of about 145&deg; C. to about 165&deg; C. for about four to about six minutes, and reflowing above the solder's melting point.

Method of reflowing organic packages using no-clean flux

A planar lightwave circuit assembly has an optical layer on a substrate. The substrate is attached to one face of a riser. A layer of a material having properties substantially the same as the substrate is attached to the other face of the riser. The layer of material counteracts the tendency of the assembly to bow as a result of differences in the coefficients of thermal expansion of the riser and substrate. This reduces stress-induced changes in performance characteristics of lightwave circuits in the optical layer.

Lightwave circuit assembly having low deformation balanced sandwich substrate

A boat is formed with a plurality of through-holes sized to securely maintain ceramic or organic flip chip semiconductor packages in place during assembly. Embodiments comprises a boat having a bottom layer with an array of four-sided through-holes and a top layer with an array of through-holes and tabs extending from the sides of the through-hole. Embodiments further include a boat having a bottom layer with through-holes smaller than substantially aligned overlying through-holes in the top layer, the substantially aligned through-holes forming flip chip package holding pockets. An alignment mechanism ensures that components are accurately positioned on flip chip packages held in the boat during assembly.

Boat for organic and ceramic flip chip package assembly

The present invention provides a method for modifying a C4 device, the device including a circuit, a polyimide layer, and a plurality of solder bumps in the active region of the C4 device. The method includes removing the polyimide layer using a plasma etch, the plasma etch comprising a mixture of oxygen and an inert gas; modifying the circuit; and cleaning the modified C4 device with a reactive flux. By mixing the oxygen with an inert gas, the oxidation of the solder bumps due to the plasma etch are reduced. Because the top layer features are now readily visible, circuit structures are more easily located, and modification can be more easily performed and with more accuracy. In the preferred embodiment, the device is then cleaned with a reactive flux, which removes any oxidation layer which has formed on the solder bumps. In this manner, circuit modification may be performed more quickly while also minimizing the oxidation of the solder bumps. The reduced oxidation of the solder bumps will help the C4 packaging process to be successful for electrical testing after focused beam ion (FIB) modification. Also, since the costly FIB process is not required to locally remove the polyimide layer for locating circuit structures, the cost of device fabrication is reduced.

Method for modifying a C4 semiconductor device

A method of manufacturing a flip-chip semiconductor device by attaching a semiconductor die to a substrate using solder comprises the steps of applying a no-clean flux to the semiconductor die and the substrate; heating the solder and the flux in a furnace to bond the semiconductor die to the substrate; and underfilling between the semiconductor die and the substrate. While the solder and flux is being heated, a reducing atmosphere in the furnace is being measured to determine the moisture content. When the moisture content exceeds a threshold amount, a signal will be provided. A reflow furnace for practicing the method is also disclosed.

Minimizing flux residue by controlling amount of moisture during reflow

When soldering semiconductor devices in a solder reflow furnace flux is vaporized and carried to the furnace exhaust pipe. The flux condenses on the walls of the exhaust pipe and drips back into the furnace contaminating production parts. A solder reflow furnace with a flux effluent collector prevents flux drip-back. The flux effluent collector has an exhaust gas heater that maintains flux effluent in a gaseous state, a flux cooler, to subsequently condense flux, and a flux condensation region where the flux condenses. The flux condensation region is offset from the furnace's exhaust opening so that condensed flux cannot drip back into the furnace.

Solder reflow furnace with flux effluent collector and method of preventing flux contamination

A method of assembling a substrate and die in a flip chip configuration using a no clean flux. The no clean fluxes have sufficient chemical activity to activate solder bumps contacting bond pads to form reliable solder joints, sufficient tackiness to hold the substrate and die in alignment with the solder bumps contacting the bond pads, and a viscosity to enable a high volume manufacturing process to be used. The no clean fluxes leave a minimal amount of residue during a reflow process that does not interfere with an underfill operation and does not adversely affect the solder joints. The no clean fluxes that can be used for this application are RM1919 from Alpha Metals, Co. and H208 from Indium Company.

No clean flux for flip chip assembly

An automated method of applying flux to substrate on which a semiconductor chip is to be assembled in a flip chip configuration by applying a controlled amount of flux to the substrate by a brush that applies the flux to the substrate in a programmed pattern of strokes thereby overcoming the surface tension of the flux/substrate surface. The programmed pattern of brush strokes is determined empirically for the specific combination of substrate and chip that is being assembled and is thus repeatable and operator independent. The empirically determined program also determines the amount of flux that will be applied to the substrate for the specific combination of substrate and chip being assembled. The empirically determined program is applied to a mechanical stage that moves the brush and to a flux reservoir by a CPU.

Growing community of inventors

San Jose, CA, United States of America

Maria G Guardado