Manuel Harrant

Title: Manuel Harrant: Innovator in Chip Packaging Technology

Introduction

Manuel Harrant is a notable inventor based in Taufkirchen, Germany. He has made significant contributions to the field of chip packaging technology, holding a total of 3 patents. His work focuses on innovative methods and systems that enhance the functionality and efficiency of chip packages.

Latest Patents

Harrant's latest patents include a chip package, a chip package system, a method of manufacturing a chip package, and a method of operating a chip package. These inventions feature a first sensor designed to measure a magnetic field component up to a maximum magnetic field value, and a second sensor that measures the magnetic field component beyond this maximum value. A circuit is integrated with these sensors to select which one to use based on the received sensor signal. Additionally, he has developed a load driver circuit that drives an electric or electronic load, incorporating a power supply circuit and a measurement circuit to estimate model parameters based on operational parameters of the load.

Career Highlights

Manuel Harrant is currently employed at Infineon Technologies AG, where he continues to push the boundaries of technology in his field. His innovative approach has led to advancements that are crucial for the development of modern electronic systems.

Collaborations

Harrant collaborates with esteemed colleagues such as Thomas Nirmaier and Georg Pelz, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Manuel Harrant's contributions to chip packaging technology exemplify the spirit of innovation. His patents reflect a commitment to advancing electronic systems, making him a key figure in the industry.