Infineon Technologies Ag

Manuel Harrant

Georg Pelz

Thomas Nirmaier

Rainer Markus Schaller

Goran Keser

Jerome Kirscher

A chip package, a chip package system, a method of manufacturing a chip package, and a method of operating a chip package including: a first sensor configured to measure a magnetic field component up to a maximum magnetic field value; a second sensor configured to measure the magnetic field component beyond the maximum magnetic field value; and a circuit coupled to the first sensor and the second sensor and configured to receive at least one sensor signal from at least one of the first sensor and the second sensor, wherein the circuit is further configured to select the first sensor or the second sensor to measure the magnetic field component based on the received sensor signal.

Chip package, a chip package system, a method of manufacturing a chip package, and a method of operating a chip package

A load driver circuit for driving an electric or electronic load is described. In accordance with one example, a circuit includes a power supply circuit operably coupled to the load and configured to provide a load current operably passing through the load in accordance with at least one control signal. A measurement circuit is coupled to the power supply circuit or the load and configured to measure, during operation of the load, at least one operation parameter of the load. A signal processing circuit receives the at least one operation parameter measured by the measurement circuit and is configured to estimate, based on the at least one operation parameter and a parametric model that characterizes the load, one or more model parameters of the parametric model.

Load driver circuit including load model parameter estimation

A system is described that includes a power bus, a power source configured to supply power to the power bus, and a device receiving at least some of the power supplied by the power source. The device is configured to determine a quality level of the power received from the power bus, and perform an operation of the device according to the quality level of the power. The quality level of the power may be determined on an output from a wavelet transform. For example, the device may apply a wavelet transform to a function based on the power, isolate disturbances from the output of the wavelet transform, and based on the disturbances, determine the quality level of the power.

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Taufkirchen, Germany

Manuel Harrant