This inventor holds 1 USPTO granted patent. Top assignee: Ansys, Inc.. Active years: 2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019
Title: The Innovations of Manoj Nagulapally
Introduction
Manoj Nagulapally is a notable inventor based in Austin, TX (US). He has made significant contributions to the field of multi-chip module packages through his innovative patent. His work focuses on the generation of network models that enhance the performance and efficiency of these complex systems.
Latest Patents
Manoj holds a patent for a "Multi-chip module package compact thermal models." This patent provides a method for generating network models for multi-chip module packages, which combine compact models for each chip within such packages. The invention utilizes a combination of single chip extraction methods and a linear superposition technique to predict junction temperatures of MCM packages. Related methods, systems, apparatus, and articles are also described in the patent.
Career Highlights
Manoj Nagulapally is currently employed at Ansys, Inc., where he continues to develop innovative solutions in the field of thermal modeling and multi-chip module technology. His expertise and contributions have positioned him as a valuable asset to the company.
Collaborations
He has collaborated with talented coworkers such as Vamsi Krishna Yaddanapudi and Ankit R Adhiya, further enhancing the innovative environment at Ansys, Inc.
Conclusion
Manoj Nagulapally's work in the field of multi-chip module packages exemplifies the importance of innovation in technology. His patent and contributions continue to influence advancements in thermal modeling and system efficiency.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile