Kumberg, Austria

Manfred Riedler


 

Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 67(Granted Patents)


Company Filing History:


Years Active: 2009-2015

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2 patents (USPTO):Explore Patents

Title: Manfred Riedler: Innovator in Multilayered Printed Circuit Boards

Introduction

Manfred Riedler is a notable inventor based in Kumberg, Austria. He has made significant contributions to the field of electronics, particularly in the development of advanced printed circuit boards. With a total of 2 patents to his name, Riedler's work focuses on enhancing the performance and safety of electronic components.

Latest Patents

Riedler's latest patents include innovations in multilayered printed circuit boards and thin-film assemblies. One of his patents describes a multilayered printed circuit board that is flame-resistant and smoke-suppressing. This invention consists of interconnected layers made from incombustible, conductive materials, separated by non-conductive layers. The design ensures that the printed circuit board has improved flame resistance and reduced smoke evolution.

Another significant patent involves a thin-film assembly that includes a substrate and at least one electronic thin-film component. This assembly utilizes thin-film technology to enhance the performance of electronic devices. The substrate is a printed circuit board that features a metal coating as the conductor layer, which is smoothed to accommodate the thin-film component.

Career Highlights

Manfred Riedler is associated with AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading company in the field of printed circuit board manufacturing. His work at AT&S has allowed him to push the boundaries of technology in electronic components, contributing to advancements that benefit various industries.

Collaborations

Riedler has collaborated with notable coworkers such as Ronald Frosch and Markus Wuchse. Their combined expertise has fostered innovation and development in the field of electronics.

Conclusion

Manfred Riedler's contributions to multilayered printed circuit boards and thin-film assemblies highlight his role as a key innovator in the electronics industry. His patents reflect a commitment to improving safety and performance in electronic devices.

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