The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2009
Filed:
Sep. 09, 2004
Markus Wuchse, Hausmannstaetten, AT;
Nikolai Haslebner, Zeltweg, AT;
Ronald Frosch, Graz, AT;
Manfred Riedler, Kumberg, AT;
Günther Leising, Graz, AT;
Markus Wuchse, Hausmannstaetten, AT;
Nikolai Haslebner, Zeltweg, AT;
Ronald Frosch, Graz, AT;
Manfred Riedler, Kumberg, AT;
Günther Leising, Graz, AT;
Abstract
A thin-film assembly () including a substrate () and at least one electronic thin-film component () applied on the substrate by thin-film technology, wherein a base electrode () is provided on the substrate, on which base electrode thin-film layers () forming part of the thin-film component are arranged together with an upper top electrode (); the substrate () is comprised of a printed circuit board () known per se and including an insulation-material base body () and a metal coating as the conductor layer (), wherein the conductor layer () forms the base electrode () and, to this end, is smoothed at least on the location of the thin-film component (), and wherein a contact layer () is applied by thin-film technology between the smoothed, optionally reinforced, conductor layer () and the superimposed thin-film layers () of the thin-film component (), which contact layer is physically or chemically adsorbed on the surface of the base electrode ().