This inventor holds 4 USPTO granted patents and 1 published patent application and 4 EPO patents. Top assignees: Epcos Ag, Tdk Electronics Ag. Active years: 2010-2020.
Location History:
- Gr. St. Florain, AT (2017)
- Gr. St. Florian, AT (2010 - 2020)
Company Filing History:
Years Active: 2010-2020
Title: Manfred Reinisch: Innovator in Ceramic Multi-Layer Components
Introduction
Manfred Reinisch is a notable inventor based in Sankt Florian, Austria. He has made significant contributions to the field of ceramic technology, particularly in the production of ceramic multi-layer components. With a total of 4 patents to his name, Reinisch's work has advanced the methods used in creating complex ceramic structures.
Latest Patents
Reinisch's latest patents include innovative methods for producing ceramic multi-layer components. One of his patents describes a method that involves providing green layers for ceramic multi-layer components, stacking these layers, and pressing them into a block. This process includes singulating the block into partial blocks, thermally treating them, and machining their surfaces to create recesses. Another patent focuses on producing a ceramic multilayer element by forming multilayer segments in a green state and sintering them to create a cohesive ceramic structure.
Career Highlights
Throughout his career, Manfred Reinisch has worked with prominent companies in the electronics sector, including Epcos AG and TDK Electronics AG. His experience in these organizations has allowed him to refine his expertise in ceramic technologies and contribute to various innovative projects.
Collaborations
Reinisch has collaborated with notable colleagues such as Werner Stocker and Franz Veronik. These partnerships have further enriched his work and have led to advancements in the field of ceramic multi-layer components.
Conclusion
Manfred Reinisch's contributions to ceramic technology through his patents and collaborations highlight his role as an influential inventor. His innovative methods continue to shape the future of ceramic multi-layer components.