The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2020

Filed:

Jul. 21, 2015
Applicant:

Epcos Ag, Munich, DE;

Inventors:

Marion Ottlinger, Deutschlandsberg, AT;

Peter Windisch, Deutschlandsberg, AT;

Robert Krumphals, Deutschlandsberg, AT;

Manfred Reinisch, Gr. St. Florian, AT;

Martin Galler, Karlsdorf, AT;

Georg Kügerl, Eibiswald, AT;

Assignee:

TDK ELECTRONICS AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/083 (2006.01); H01L 41/337 (2013.01); H01L 41/273 (2013.01); H01L 41/338 (2013.01); H01L 41/047 (2006.01); H01L 21/304 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0831 (2013.01); H01L 41/0471 (2013.01); H01L 41/0477 (2013.01); H01L 41/0833 (2013.01); H01L 41/273 (2013.01); H01L 41/337 (2013.01); H01L 41/338 (2013.01); H01G 4/304 (2013.01); H01L 21/3043 (2013.01); Y10T 29/42 (2015.01);
Abstract

Methods for producing ceramic multi-layer components and multi-layer components made by such methods. A method includes the following steps: providing green layers for the ceramic multi-layer components, stacking the green layers into a stack and subsequently pressing the stack into a block, singulating the block into partial blocks each having a longitudinal direction, thermally treating the partial blocks and subsequently machining surfaces of the partial blocks. Recesses are produced on the surfaces of the partial blocks during the machining, and the partial blocks are singulated.


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