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Munich, Germany

Tdk Electronics Ag

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USPTO Granted Patents = 244

% Expired Patents = 2.5

CIPO Patents = 1

EPO Patents = 221

Trademarks = 9

Forward Citations = 210

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323 inventors (with patents filed for the assignee):

Robert Hoffmann (18 out of 24 patents)

Markus Puff (14 out of 34 patents)

Thomas Feichtinger (11 out of 52 patents)

4. Franz Rinner (11 out of 42 patents)

5. Tomohiro Terada (10 out of 12 patents)

6. Jan Ihle (10 out of 27 patents)

7. László Dobai (10 out of 10 patents)

8. Frank Werner (10 out of 32 patents)

9. Tomoya Imura (10 out of 15 patents)

10. Harald Kastl (9 out of 12 patents)

11. Johann Pichler (9 out of 9 patents)

12. Stefan Nettesheim (8 out of 23 patents)

13. Norbert Will (8 out of 19 patents)

14. Masakazu Hirose (8 out of 32 patents)

15. Goushi Tauchi (8 out of 16 patents)

Core Competencies:

Sensor Arrangement

Piezoelectric Device

Inductive Component

Ceramic Electrode

Coil Manufacturing

Electrical Component

Hybrid Capacitor

EMC Filter

Haptic Signal

3D Printing

Electrical Inverter

Dielectric Barrier Discharge

244 patents: Sort by Forward Citations

1. 12794149 - Contact arrangement, electrical component with a contact arrangement, and electrical device (2026-11-10),

2. 12784995 - Hybrid polymer capacitor (2026-11-03),

3. 12782556 - Ultrasonic transducer and method for producing an ultrasonic transducer (2026-11-03),

4. 12759233 - 3D printer for additive manufacturing of a multilayer component, printing method and component (2026-10-13),

5. 12744160 - Process of manufacturing a dielectric for a capacitor and process of manufacturing a capacitor and capacitor (2026-09-22),

6. 12721167 - Cooling system (2026-08-25),

7. 12695040 - Housing assembly comprising a housing with plug-in side (2026-07-28),

8. 12695017 - Choke for a multi-conductor system (2026-07-28),

9. 12688975 - Capacitor with laminated round-shaped bus bar (2026-07-21),

10. 12684299 - Electrodes for microelectromechanical system microphones (2026-07-14),

11. 12683091 - Capacitor and method of forming a capacitor (2026-07-14),

12. 12652959 - Piezoelectric assembly and process of forming a piezoelectric assembly (2026-06-09),

13. 12634019 - Acoustic transmission system, primary circuit, secondary circuit, method for transmitting and use of an acoustic transmission system (2026-05-19),

14. 12620521 - Coil and method for producing a coil (2026-05-05),

15. 12611537 - Ceramic electrode, assembly comprising the ceramic electrode, arrangement comprising the ceramic electrode, and method of manufacturing a ceramic electrode (2026-04-28),

Company Overview

TDK Electronics AG, based in Munich, Germany, specializes in advanced sensor technology and a wide range of electronic components. The company focuses on developing innovative solutions in sensor arrangements, piezoelectric devices, and inductive components, catering to various industries. TDK's expertise extends to ceramic electrodes, coil manufacturing, hybrid capacitors, and EMC filters, positioning it as a key player in the electronics sector, committed to enhancing performance and reliability in electronic applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Nov 10 2026

244 Patents

#27 in W-8000 Munich

#235 in Germany

#3,554 in the World

Munich, Germany

Tdk Electronics Ag

Forward Citations = 210

323 inventors:

Robert Hoffmann (18 out of 24 patents)

Markus Puff (14 out of 34 patents)

Thomas Feichtinger (11 out of 52 patents)

4. Franz Rinner (11 out of 42 patents)

5. Tomohiro Terada (10 out of 12 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Tdk Electronics Ag. Retrieved from https://idiyas.com/company/tdk-electronics-ag

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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