Company Filing History:
2 out of 234 
1 out of 124 Years Active: 2012-2014
Title: Innovations of Man Kit Mui
Introduction
Man Kit Mui is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of wire bonding technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and effectiveness of bonding processes in electronic devices.
Latest Patents
Among his latest patents is the "Wedge Bonder and a Method of Cleaning a Wedge Bonder." This invention discloses a wedge bonder that includes a wedge for bonding a wire to surfaces, a cleaning device for maintaining the wedge, and a positioning device that facilitates the movement of the wedge to the cleaning device. This innovation aims to streamline the cleaning process of the wedge, ensuring optimal performance. Another significant patent is the "Universal Bond Head for Wire Bonders." This invention features a wedge that oscillates along a transducer axis for wire bonding and includes a wire clamp with parallel clamping plates. The design of the clamping plates and lateral guides ensures precise alignment and guidance of the wire during the bonding process.
Career Highlights
Man Kit Mui has worked with prominent companies in the technology sector, including ASM Technology Singapore Pte Ltd and ASM Assembly Automation Limited. His experience in these organizations has allowed him to develop and refine his innovative ideas in wire bonding technology.
Collaborations
Throughout his career, Man Kit Mui has collaborated with talented individuals, including Chi Wah Cheng and Hon Kam Ng. These partnerships have contributed to the advancement of his inventions and the overall progress in the field.
Conclusion
Man Kit Mui's contributions to wire bonding technology through his patents and collaborations highlight his innovative spirit and dedication to improving electronic manufacturing processes. His work continues to influence the industry and pave the way for future advancements.