The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Dec. 08, 2010
Chi Wah Cheng, Tsing Yi, HK;
Man Kit Mui, Kowloon, HK;
Hon Kam NG, Tsing Yi, HK;
Hei Lam Chang, Yuen Long, HK;
Chi Wah Cheng, Tsing Yi, HK;
Man Kit Mui, Kowloon, HK;
Hon Kam Ng, Tsing Yi, HK;
Hei Lam Chang, Yuen Long, HK;
ASM Assembly Automation Ltd, Hong Kong, HK;
Abstract
A wire is bonded to a target surface using a rotary bond head by positioning a wedge bonding tool of the bond head over the target surface. A camera system is tilted at an oblique angle relative to an arrangement of the bond head to conduct pattern recognition of bonding points on the target surface for determining actual positions of the bonding points and an orientation between the actual positions of first and second bonding points. The bond head is moved to the actual position of the first bonding point and rotated to the determined orientation. Thereafter, the wire is bonded to the target surface at the first bonding point with the bond head.