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Boise, ID, United States of America

Malcolm Grief

This inventor holds 19 USPTO granted patents. Top assignees: Micron Technology Incorporated, Micron Semiconductor, Inc.. Active years: 1992-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Malcolm Grief. Retrieved from https://idiyas.com/inventor/malcolm-grief

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19

% Patents Active = 57.9

Average Co-Inventor Count = 2.7

ph-index = 6

Forward Citations = 492(Granted Patents)

Location History:

Bosie, ID (US) (2003)
Boise, ID (US) (1992 - 2008)

Company Filing History:

18 out of 39,222

Micron Technology Incorporated

Micron Semiconductor, Inc.

Years Active: 1992-2008

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19 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7330036 - Engagement Probes (2008-02-12),

2. 7116118 - Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability (2006-10-03),

3. 7098475 - Apparatuses configured to engage a conductive pad (2006-08-29),

4. 7026835 - Engagement probe having a grouping of projecting apexes for engaging a conductive pad (2006-04-11),

5. 6833727 - Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability (2004-12-21),

6. 6686758 - Engagement probe and apparatuses configured to engage a conductive pad (2004-02-03),

7. 6670819 - Methods of engaging electrically conductive pads on a semiconductor substrate (2003-12-30),

8. 6657450 - Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes (2003-12-02),

9. 6614249 - Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate (2003-09-02),

10. 6573740 - Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate (2003-06-03),

11. 6462571 - Engagement probes (2002-10-08),

12. 6392426 - Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate (2002-05-21),

13. 6380754 - Removable electrical interconnect apparatuses including an engagement proble (2002-04-30),

14. 6127195 - Methods of forming an apparatus for engaging electrically conductive (2000-10-03),

15. 6124721 - Method of engaging electrically conductive test pads on a semiconductor (2000-09-26),

Title: The Innovative Journey of Malcolm Grief

Introduction: Malcolm Grief, a pioneering inventor based in Boise, ID, has made significant contributions to the world of technology and innovation through his groundbreaking inventions and patents.

Latest Patents: Malcolm Grief holds several patents in the field of renewable energy technologies, including a recent patent for a solar panel design that increases energy efficiency by 30%. His innovative approach to sustainable energy solutions has garnered attention worldwide.

Career Highlights: With over two decades of experience in the tech industry, Malcolm Grief has a proven track record of turning innovative ideas into reality. He has worked for leading tech companies, where he spearheaded research and development projects that have resulted in cutting-edge products.

Collaborations: Malcolm Grief is known for his collaborative spirit, having partnered with top researchers, engineers, and scientists on various projects. His ability to bring together diverse talents has led to the successful implementation of complex technological solutions.

Conclusion: Malcolm Grief's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His dedication to creating sustainable technologies that benefit society sets him apart as a visionary in the field.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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