Maki Yonetsu

Title: Maki Yonetsu: Innovator in Ceramic-Copper Circuit Board Technology

Introduction

Maki Yonetsu is a notable inventor based in Mitaka, Japan. He has made significant contributions to the field of semiconductor devices, particularly through his innovative patent related to bonded bodies and circuit boards.

Latest Patents

Maki Yonetsu holds a patent for a bonded body, ceramic-copper circuit board, and semiconductor device. This invention includes a ceramic substrate, a copper plate, and a bonding layer. The bonding layer is strategically placed on at least one surface of the ceramic substrate, effectively bonding the ceramic substrate and the copper plate. The bonding layer comprises silver (Ag) and titanium (Ti). The copper plate is divided into three regions: the first region is separated from the bonding layer in the thickness direction, the second region is situated between the bonding layer and the first region with a higher Ag concentration, and the third region is located between the bonding layer and the second region with a lower Ag concentration.

Career Highlights

Maki Yonetsu is currently employed at Niterra Materials Co., Ltd., where he continues to develop innovative technologies in the semiconductor field. His work has garnered attention for its potential applications in various electronic devices.

Collaborations

Maki collaborates with talented colleagues, including Seiichi Suenaga and Sachiko Fujisawa, who contribute to the innovative environment at Niterra Materials Co., Ltd.

Conclusion

Maki Yonetsu's contributions to the field of semiconductor technology through his patent on bonded bodies and ceramic-copper circuit boards highlight his role as an influential inventor. His work continues to pave the way for advancements in electronic device manufacturing.