Lynn H Chen

Title: Innovations by Lynn H Chen

Introduction

Lynn H Chen is an accomplished inventor based in Gilbert, AZ (US). She has made significant contributions to the field of integrated circuit packaging, holding 2 patents that showcase her innovative approach to technology.

Latest Patents

One of her latest patents is for an integrated circuit (IC) package with spatially varied solder resist opening dimensions. This invention involves a stack of substrates interconnected by solder, featuring solder resist openings (SRO) with mixed lateral dimensions that are spatially varied across the substrate area. The SRO dimensions are adjusted based on the estimated gap between the substrates, which varies depending on the location within the substrate area. In cases where deflection in at least one substrate affects the conformality between the substrates, the invention provides a varying solder joint height from a fixed volume of solder. This is achieved by reducing the lateral dimensions of the SRO in regions with larger gaps compared to those with smaller gaps. The first substrate can be an IC chip, package substrate, or interposer, while the second substrate may be another IC chip, package substrate, interposer, or printed circuit board (PCB).

Career Highlights

Lynn H Chen is currently employed at Intel Corporation, where she continues to push the boundaries of innovation in integrated circuit technology. Her work has been instrumental in advancing the efficiency and reliability of electronic devices.

Collaborations

Lynn has collaborated with notable coworkers, including Tieyu Zheng and Sumit Kumar, contributing to a dynamic and innovative work environment.

Conclusion

Lynn H Chen's contributions to integrated circuit packaging exemplify her dedication to innovation and technology. Her patents reflect a deep understanding of the complexities involved in electronic design, making her a valuable asset in her field.