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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Lung-Tai Chen

USPTO Granted Patents = 14

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 247(Granted Patents)


Location History:

  • Chutung Hisnchu, TW (1997)
  • Hsinchu, TW (1999)
  • Kaohsiung County, TW (2011 - 2013)
  • Fengshan, TW (2014)
  • Fongshan, TW (2010 - 2016)
  • Kaohsiung, TW (2013 - 2016)

Company Filing History:

goldMedal14 out of 9,138 
 
Industrial Technology Research Institute
 patents

Years Active: 1997-2025

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14 patents (USPTO):
1. 12191219 - Gas-permeable package lid of chip package structure and manufacturing method thereof (2025-01-07),
2. 9445212 - MEMS microphone module and manufacturing process thereof (2016-09-13),
3. 9343651 - Organic packaging carrier (2016-05-17),
4. 9133018 - Structure and fabrication method of a sensing device (2015-09-15),
5. 8763457 - Sensing device and manufacturing method thereof (2014-07-01),
6. 8693711 - Capacitive transducer and fabrication method (2014-04-08),
7. 8643125 - Structure and process for microelectromechanical system-based sensor (2014-02-04),
8. 8421543 - Crystal oscillator and method for manufacturing the same (2013-04-16),
9. 8421216 - Vacuum hermetic organic packaging carrier (2013-04-16),
10. 7973454 - Vacuum hermetic organic packaging carrier and sensor device package (2011-07-05),
11. 7915065 - Wafer level sensing package and manufacturing process thereof (2011-03-29),
12. 7791181 - Device structure with preformed ring and method therefor (2010-09-07),
13. 5903052 - Structure for semiconductor package for improving the efficiency of (1999-05-11),
14. 5695109 - Solder paste inter-layer alignment apparatus for area-array on-board (1997-12-09),

Title: Innovations of Lung-Tai Chen

Introduction

Lung-Tai Chen is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of technology, particularly in the development of advanced packaging solutions and MEMS microphone modules. With a total of 14 patents to his name, Chen continues to push the boundaries of innovation.

Latest Patents

One of his latest inventions is the gas-permeable package lid of a chip package structure and its manufacturing method. This innovative lid includes a lid body, a through hole, and a hydrophobic gas-permeable membrane. The design allows for effective gas permeability while maintaining the integrity of the chip package. Another notable patent is the MEMS microphone module and its manufacturing process. This invention involves adjusting the thickness of a transparent temporary cover plate in a conventional plastic package structure, utilizing UV rays to enhance the manufacturing process, and defining the back-volume of the MEMS microphone.

Career Highlights

Lung-Tai Chen is affiliated with the Industrial Technology Research Institute, where he has been instrumental in various research and development projects. His work has not only advanced the technology in his field but has also contributed to the growth of the industry in Taiwan.

Collaborations

Throughout his career, Chen has collaborated with several talented individuals, including Tzong-Che Ho and Li-Chi Pan. These collaborations have fostered a creative environment that has led to numerous successful innovations.

Conclusion

Lung-Tai Chen's contributions to technology through his patents and collaborations highlight his role as a leading inventor in the industry. His innovative solutions continue to impact the field positively, showcasing the importance of research and development in advancing technology.

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