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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9343651 B1

PDFFull Text
Date of Patent:
May. 17, 2016

Filed:

Jun. 07, 2012

Organic packaging carrier

Applicants:

Lung-tai Chen, Kaohsiung, TW;

Tzong-che Ho, Hsinchu, TW;

Li-chi Pan, Hsinchu County, TW;

Yu-wen Fan, Hsinchu, TW;

Inventors:

Lung-Tai Chen, Kaohsiung, TW;

Tzong-Che Ho, Hsinchu, TW;

Li-Chi Pan, Hsinchu County, TW;

Yu-Wen Fan, Hsinchu, TW;

Assignee:

Industrial Technology Research Institute, Hsinchu, TW;

Attorney:

Jianq Chyun IP Office

Primary Examiner:

Mohammad Islam

Assistant Examiner:

Jay C Chang

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/12 (2006.01); H01L 23/053 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); H01L 23/34 (2006.01); H01L 41/053 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0533 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H03H 9/0509 (2013.01); H03H 9/1014 (2013.01);
Abstract

An organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and a sealing metal layer. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and includes at least a conductive layer and a sealing ring. The sealing ring is a closed ring. The sealing metal layer is located on the sealing ring, wherein a material of the sealing metal layer includes AgSn and is lead-free.

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